If we call the SEM and TEM eyes in the nano world, based on the usage of the electron beam, then the FIB would be considered the knife used to cut nano objects, based on the usage of the focused ion beam. These viewing and cutting functions are combined together in Dual Beam FIB system.
Our DB237 Dual Beam FIB System consists of electron and ion columns, Pt and XeF2 gas injectors, OMNI probes, EDAX EDS systems, flip stage, SE/TLD/STEM (dark field) / STEM (bright field) / CDEM/CCD electron/ion/photon detectors.
The potential usage of this instrument is unlimited, i.e., TEM specimen preparation from a selected area, cross section SEM imaging, controlled milling/deposition, composition depth profiling, three-dimensional image construction, etc.
| Instrument capabilities for function |
| Schottky type field emission source |
| Everhart-Thornley secondary electron detector |
| liquid Gallium ion emitter |
| bright field STEM/ dark field STEM |
| qualitative elemental analysis |
| quantitative elemental analysis |
| spectrum mapping |
| three-dimensional elemental analysis |
| fully computer controlled easy operation |
| digital image recording |
| CDEM detector |
| Pt gas injector, XeF2 gas injector |
| Pt deposition, sample etching through XeF2 |
| specimen chamber monitoring CCD camera |
| OMNI probe 100.7 |
| EDAX GENESIS XMS 4000 Imaging 60 SEM EDS |
| accelerating voltage for electron beam: 200 V to 30 kV |
| accelerating voltage for ion beam: 5-30 kV |
| SEM imaging ultrahigh resoultion to nm |
| FIB imaging to resolution of 7 nm |
| in-situ STEM imaging / TEM specimen preparation |